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Silicon interposer, TSMC (Chiayi)
Chiayi, Taiwan23.48°N 120.45°E
computed criticality18/100
reading
Interposers > a litho field size; assembled by "stitching"
2025Fault line
Beneath every AI accelerator lies a passive silicon wafer, the interposer, that links GPU and HBM stacks through tens of thousands of micro-vias. Its size exceeds the limit of a lithography field, requiring an assembly that only TSMC masters at scale. The limiting factor of CoWoS is not the logic but this silicon foundation.
Actors
TSMC (advanced packaging, Chiayi / Tainan)
Feeds 1
CoWoS advanced packaging, TSMC TainanCompute↗Sources